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WAVE-35-21 WAVE-40-125 WAVE-29-127 有現貨 可添加我們聯系方式獲取最優惠價格
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Wakefield-Vette Wave Series Heats Sinks with Integrated Clip Assembly are designed for cooling BGA applications with limited height and footprint. A fin array design allows the series to achieve maximum surface area. Wave Series Heat Sinks include a clipping mechanism that allows for superior heat transfer while securing the heat sink to the BGA. The clipping mechanism of this Wakefield-Vette series allows for easy installation in high production assembly. Thermal resistance for these heat sinks ranges from 2.11C/W to 6.76C/W.
Features
Approximately 12% better thermal performance than traditional footprint heat sinks
Low-profile design allows for more surface area in height-restricted applications
Clipping mechanism included with heat sink
Fin array allows for more surface area for forced convection
Easily customizable
Easily compatible with major BGA device manufacturers' components
Specifications
2.11C/W to 6.76C/W thermal resistance
6055.1mm2 to 22,303.7mm2 surface area
Aluminum Alloy 6063-T5 with black anodized finish heat sink
304 Stainless Steel, 1.2mm diameter spring clip
WAVE-35-21
WAVE-40-125
WAVE-29-127
WAVE-35-15
WAVE-34-21
WAVE-32-12
WAVE-32-12
WAVE-40-12
WAVE-35-12
WAVE-366-175
WAVE-425-117
WAVE-35-125
WAVE-23-125
WAVE-26-12
WAVE-23-165
WAVE-ANC1
WAVE-ANC2
WAVE-35-21 制造商: Wakefield-Vette
產品種類: 散熱片
產品: Heat Sinks
安裝風格: Clip
散熱片材料: Aluminum Alloy
熱阻: 2.11 C/W
長度: 35 mm
寬度: 35 mm
高度: 21 mm
設計目的: BGA Semiconductors
顏色: Black
系列: Wave
商標: Wakefield-Vette
產品類型: Heat Sinks
子類別: Heat Sinks
單位重量: 27.200 g
Wakefield-Vette Wave Series Heats Sinks with Integrated Clip Assembly are designed for cooling BGA applications with limited height and footprint. A fin array design allows the series to achieve maximum surface area. Wave Series Heat Sinks include a clipping mechanism that allows for superior heat transfer while securing the heat sink to the BGA. The clipping mechanism of this Wakefield-Vette series allows for easy installation in high production assembly. Thermal resistance for these heat sinks ranges from 2.11C/W to 6.76C/W.
Features
Approximately 12% better thermal performance than traditional footprint heat sinks
Low-profile design allows for more surface area in height-restricted applications
Clipping mechanism included with heat sink
Fin array allows for more surface area for forced convection
Easily customizable
Easily compatible with major BGA device manufacturers' components
Specifications
2.11C/W to 6.76C/W thermal resistance
6055.1mm2 to 22,303.7mm2 surface area
Aluminum Alloy 6063-T5 with black anodized finish heat sink
304 Stainless Steel, 1.2mm diameter spring clip
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