USB3319C-CP

USB2514B-AEZG
USB3343-CP-TR
USB3300-EZK
USB3319C-CP-TR
USB3317C-CP-TR
LAN9220-ABZJ
LAN8710A-EZK-TR
LAN8720A-CP-TR
LAN9303-ABZJ

Descriptions
The USB331x family of Hi-Speed USB 2.0 transceivers provides a highly integrated, small footprint solution designed for portable consumer electronics devices including cell phones, PDAs, portable media players and GPS/personal navigation devices. The USB331x family eliminates the need for external USB switches and electrostatic discharge (ESD) protection devices, which minimizes eBOM part count and printed circuit board (PCB) area. The USB331x provides an extremely flexible solution which allows the USB connector to act as a single port of connection for high speed data transfer, battery charging and stereo/mono audio acce

Features
USB-IF“Hi-Speed”complianttotheUniversalSerialBusSpecificationRev2.0
InterfacecompliantwiththeULPISpecificationrevision1.1asaSingleDataRate(SDR)PHY
1.8VIOVoltage(±10%)
flexPWRTechnology
Lowcurrentdesignidealforbatterypoweredapplications
“Sleep”modetri-statesallULPIpinsandplacesthepartinalowcurrentstate
SupportsFSpre-ambleforFShubswithaLSdeviceattached(UTMI+Level3)
SupportsHSSOFandLSkeep-alivepulse
IncludesfullsupportfortheoptionalOn-The-Go(OTG)protocoldetailedintheOn-The-GoSupplementRevision1.0aspecification
SupportstheOTGHostNegotiationProtocol(HNP)andSessionRequestProtocol(SRP)
AllowshosttoturnVBUSofftoconservebatterypowerinOTGapplications
SupportOTGmonitoringofVBUSlevelswithinternalcomparators
“Wrapper-less”designforoptimaltimingperformanceanddesignease
LowLatencyHi-SpeedReceiver(43Hi-SpeedclocksMax)allowsuseoflegacyUTMILinkswithaULPIbridge
Internal5Vcableshort-circuitprotectionofID,DPandDMlinestoVBUSorground
13MHzReferenceClockOperation
0to3.6Vinputdrivetolerant
Abletoaccept“noisy”clocksources
InternallowjitterPLLfor480MHzHi-SpeedUSBoperation
InternaldetectionofthevalueofresistancetogroundontheIDpin
Integratedbatteryto3.3VLDOregulator
2.2uFbypasscapacitor
100mVdropoutvoltage
IntegratedESDprotectioncircuits
Upto±15kVwithoutanyexternaldevices
CarkitUARTmodefornon-USBserialdatatransfers
IntegratedUSBSwitch
AllowssingleUSBportofconnection
Highspeeddata
Batterycharging
Stereoandmono/micaudio
USB1.1data
IndustrialOperatingTemperature-40°Cto+85°C
PackagingOptions
24pinQFNlead-freeRoHScompliantpackage(4x4x0.90mmheight)
25ballVFBGAlead-freeRoHScompliantpackagealsoavailable;(3x3x0.88mmheight)

Applications Smart Phone

德國芯片制造商英飛凌指出，將擴展產能，協助解決全球車用晶片的短缺，有能力長期滿足客戶的需求。同時，英飛凌還預計在下半財年（截至九月底的財年），供給吃緊的情形將緩解。

車用芯片供應商英飛凌首席營銷官HelmutGassel博士在周四的年度股東大會上表示，晶圓代工制造商的營運情形不妙，擴展英飛凌自身的產能則需要時間。這也意指英飛凌自家的晶圓制造工廠產能擴充不易。Gassel補充表示，希望在本財年的下半能看見某種程度的緩解；英飛凌已經提前了奧地利Villach市新工廠的開啟計劃。

英飛凌CEO普洛斯（Reinhard Ploss）指出，奧地利Villach的新工廠，預計夏季末開始投產，每年將有能力生產足夠的電源半導體（車用電源管理晶片），足夠為2500萬輛電動車配備驅動裝置。

分析師表示，車用芯片例如微控制器的供應吃緊，將持續到今年年中；芯片制造商此前對于突然復蘇的需求未能及時調適。

英飛凌對Villach市的晶圓廠投入16億歐元（約合19.5億美元），與該公司在德國德勒斯登市（Dresden）既有的晶圓廠，共同增加了生產的彈性。Ploss表示，“這將讓我們如同一家工廠般，在兩個地方控制生產。”

英飛凌同時證實了本財年（截至9月底）的全年108億歐元營收的財測以及獲利率17.5％的目標。

英飛凌也任命了Constanze Hufenbecher，為新成立的數位轉型長，協助該公司以100億美元收購Cypress半導體之后，進行相關的合并整合工作。