EP2C8F256I8N 參數如下:
零件包裝代碼 BGA
包裝說明 FBGA-256
針數 256
Reach Compliance Code not_compliant
ECCN代碼 EAR99
HTS代碼 8542.39.00.01
風險等級 5.2
其他特性 ALSO REQUIRES 3.3 SUPPLY
最大時鐘頻率 402.5 MHz
JESD-30 代碼 S-PBGA-B256
JESD-609代碼 e0
長度 17 mm
濕度敏感等級 3
可配置邏輯塊數量 516
輸入次數 182
邏輯單元數量 8256
輸出次數 174
端子數量 256
組織 516 CLBS
封裝主體材料 PLASTIC/EPOXY
封裝代碼 LBGA
封裝等效代碼 BGA256,16X16,40
封裝形狀 SQUARE
封裝形式 GRID ARRAY, LOW PROFILE
峰值回流溫度(攝氏度) 220
電源 1.2,1.5/3.3,3.3 V
可編程邏輯類型 FIELD PROGRAMMABLE GATE ARRAY
認證狀態 Not Qualified
座面最大高度 1.55 mm
子類別 Field Programmable Gate Arrays
最大供電電壓 1.25 V
最小供電電壓 1.15 V
標稱供電電壓 1.2 V
表面貼裝 YES
技術 CMOS
端子面層 Tin/Lead (Sn63Pb37)
端子形式 BALL
端子節距 1 mm
端子位置 BOTTOM
處于峰值回流溫度下的最長時間 30
寬度 17 mm
Base Number Matches 1
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XC3S1200E5FTG256C
XC3S1400A-4FG484C
XC3S1400A-4FGG484C
XC3S1400A-4FGG484I
XC3S1400A-4FTG256C
XC3S1400A-4FTG256I
XC3S1400A-5FGG484C
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XC3S2000-5FGG456C
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XC3S400AN-4FG400I
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XC3S500E-4FGG320C
XC3S500E-4FGG320I
XC3S500E-4FT256I
XC3S500E-4FTG256C
XC3S500E-4FTG256I
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