EP2AGX45DF29I5N參數如下：

零件包裝代碼 BGA

包裝說明 29 X 29 MM, LEAD FREE, MS-034, FBGA-780

針數 780

Reach Compliance Code not_compliant

ECCN代碼 3A991

HTS代碼 8542.39.00.01

風險等級 5.25

最大時鐘頻率 500 MHz

JESD-30 代碼 S-PBGA-B780

JESD-609代碼 e1

長度 29 mm

濕度敏感等級 3

輸入次數 364

邏輯單元數量 42959

輸出次數 364

端子數量 780

最高工作溫度 100 °C

最低工作溫度 -40 °C

封裝主體材料 PLASTIC/EPOXY

封裝代碼 HBGA

封裝等效代碼 BGA780,28X28,40

封裝形狀 SQUARE

封裝形式 GRID ARRAY, HEAT SINK/SLUG

峰值回流溫度（攝氏度） 245

電源 0.9,1.2/3.3,1.5,2.5 V

可編程邏輯類型 FIELD PROGRAMMABLE GATE ARRAY

認證狀態 Not Qualified

座面最大高度 2.7 mm

子類別 Field Programmable Gate Arrays

最大供電電壓 0.93 V

最小供電電壓 0.87 V

標稱供電電壓 0.9 V

表面貼裝 YES

技術 CMOS

溫度等級 INDUSTRIAL

端子面層 Tin/Silver/Copper (Sn/Ag/Cu)

端子形式 BALL

端子節距 1 mm

端子位置 BOTTOM

處于峰值回流溫度下的最長時間 40

寬度 29 mm

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