EPM240F100I5N參數如下:
零件包裝代碼 BGA
包裝說明 11 X 11 MM, 1 MM PITCH, LEAD FREE, FBGA-100
針數 100
Reach Compliance Code unknown
ECCN代碼 EAR99
HTS代碼 8542.39.00.01
風險等級 3.8
其他特性 IT CAN ALSO OPERATE AT 3.3V
系統內可編程 YES
JESD-30 代碼 S-PBGA-B100
JESD-609代碼 e1
JTAG BST YES
長度 11 mm
濕度敏感等級 3
專用輸入次數
I/O 線路數量 80
宏單元數 192
端子數量 100
組織 0 DEDICATED INPUTS, 80 I/O
輸出函數 MACROCELL
封裝主體材料 PLASTIC/EPOXY
封裝代碼 LBGA
封裝等效代碼 BGA100,10X10,40
封裝形狀 SQUARE
封裝形式 GRID ARRAY, LOW PROFILE
峰值回流溫度(攝氏度) 260
電源 1.5/3.3,2.5/3.3 V
可編程邏輯類型 FLASH PLD
傳播延遲 7.5 ns
認證狀態 Not Qualified
座面最大高度 1.7 mm
子類別 Programmable Logic Devices
最大供電電壓 2.625 V
最小供電電壓 2.375 V
標稱供電電壓 2.5 V
表面貼裝 YES
技術 CMOS
端子面層 Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL
端子節距 1 mm
端子位置 BOTTOM
處于峰值回流溫度下的最長時間 40
寬度 11 mm
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