型號：THGBMHG6C1LBAIL

品牌：TOSHIBA/東芝

封裝：BGA

批次：新批次

AM3354BZCZD80 TI/德州儀器 21+ BGA
MSP430F4152IPMR TI/德州儀器 21+ BGA
SN74AVCAH164245KR TI/德州儀器 21+ BGA
TLV320AIC23BGQER TI/德州儀器 21+ BGA
TMS320TCI6484CMH TI/德州儀器 21+ BGA
TMS320VC5510AZGWA2 TI/德州儀器 21+ BGA
TPA6201A1ZQVR TI/德州儀器 21+ BGA
AM3352BZCZD60 TI/德州儀器 21+ BGA
CC2564BYFVR TI/德州儀器 21+ BGA
TC58CVG1S3HRAIG TOSHIBA/東芝 21+ BGA
THGBMDG5D1LBAI TOSHIBA/東芝 21+ BGA
THGBMDG5D1LBAIL TOSHIBA/東芝 21+ BGA
THGBMHG6C1LBAIL TOSHIBA/東芝 21+ BGA
EP4SGX530KH40I3N XILINX/賽靈思 21+ BGA
FS32K142UAT0VLHT XILINX/賽靈思 21+ BGA
XA7Z010-1CLG400I XILINX/賽靈思 21+ BGA
XA7Z020-1CLG400Q XILINX/賽靈思 21+ BGA
XAZU3EG-1SFVC784I XILINX/賽靈思 21+ BGA
XC2C128-7CPG132I XILINX/賽靈思 21+ BGA
XC3S1000-4FTG256I XILINX/賽靈思 21+ BGA
XC3S1400A-4FGG484I XILINX/賽靈思 21+ BGA
XC3S200A-4FTG256I XILINX/賽靈思 21+ BGA
XC3S250E-4PQG208I XILINX/賽靈思 21+ BGA
XC3S250E-4TQG144I XILINX/賽靈思 21+ BGA
XC3S250E-4VQG100I XILINX/賽靈思 21+ BGA
XC3S4000-4FGG676C XILINX/賽靈思 21+ BGA
XC3S400-4FTG256C XILINX/賽靈思 21+ BGA
XC3S400AN-4FTG256I XILINX/賽靈思 21+ BGA
XC3S500E-4FTG256I XILINX/賽靈思 21+ BGA
XC3S500E-4PQG208I XILINX/賽靈思 21+ BGA
XC3S50A-4VQG100C XILINX/賽靈思 21+ BGA
XC5VLX110-1FFG1153C XILINX/賽靈思 21+ BGA
XC5VLX50-2FFG324I XILINX/賽靈思 21+ BGA
工作電壓 2.7V ~ 3.6V 時鐘頻率 52 MHz 工作溫度(Max) 85 ℃ 工作溫度(Min) -25 ℃ 電源電壓 2.7V ~ 3.6V 封裝參數 安裝方式 Surface Mount 引腳數 153 封裝 WFBGA-153 外形尺寸 封裝 WFBGA-153 物理參數 工作溫度 -25℃ ~ 85℃ 其他 產品生命周期 Active 包裝方式 Tray 符合標準 RoHS標準 RoHS Compliant 含鉛標準 Lead Free 海關信息 ECCN代碼 3A991 香港進出口證