November 2014 Data Sheet DS1035 © 2014 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. Features  Flexible Logic Architecture • Six devices with 256 to 6864 LUT4s and 18 to 334 I/Os  Ultra Low Power Devices • Advanced 65 nm low power process • As low as 22 μW standby power • Programmable low swing differential I/Os • Stand-by mode and other power saving options  Embedded and Distributed Memory • Up to 240 kbits sysMEM™ Embedded Block RAM • Up to 54 kbits Distributed RAM • Dedicated FIFO control logic  On-Chip User Flash Memory • Up to 256 kbits of User Flash Memory • 100,000 write cycles • Accessible through WISHBONE, SPI, I2 C and JTAG interfaces • Can be used as soft processor PROM or as Flash memory  Pre-Engineered Source Synchronous I/O • DDR registers in I/O cells • Dedicated gearing logic • 7:1 Gearing for Display I/Os • Generic DDR, DDRX2, DDRX4 • Dedicated DDR/DDR2/LPDDR memory with DQS support  High Performance, Flexible I/O Buffer • Programmable sysIO™ buffer supports wide range of interfaces: – LVCMOS 3.3/2.5/1.8/1.5/1.2 – LVTTL – PCI – LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL – SSTL 25/18 – HSTL 18 – Schmitt trigger inputs, up to 0.5 V hysteresis • I/Os support hot socketing • On-chip differential termination • Programmable pull-up or pull-down mode  Flexible On-Chip Clocking • Eight primary clocks • Up to two edge clocks for high-speed I/O interfaces (top and bottom sides only) • Up to two analog PLLs per device with fractional-n frequency synthesis – Wide input frequency range (7 MHz to 400 MHz)  Non-volatile, Infinitely Reconfigurable • Instant-on – powers up in microseconds • Single-chip, secure solution • Programmable through JTAG, SPI or I2 C • Supports background programming of non-volatile memory • Optional dual boot with external SPI memory  TransFR™ Reconfiguration • In-field logic update while system operates  Enhanced System Level Support • On-chip hardened functions: SPI, I2 C, timer/ counter • On-chip oscillator with 5.5% accuracy • Unique TraceID for system tracking • One Time Programmable (OTP) mode • Single power supply with extended operating range • IEEE Standard 1149.1 boundary scan • IEEE 1532 compliant in-system programming  Broad Range of Package Options • TQFP, WLCSP, ucBGA, csBGA, caBGA, ftBGA, fpBGA, QFN package options • Small footprint package options – As small as 2.5 mm x 2.5 mm • Density migration supported • Advanced halogen-free packaging