Blackfin Processor Family;
標準包裝ADSP-BF537BBCZ-5B-ND;part_id=1200168;ref_supplier_id=505;ref_page_event=Standard Packaging" /> 1
包裝 托盤
零件狀態 有源
類別 集成電路(IC)
產品族 嵌入式 - DSP(數字式信號處理器)
系列 Blackfin®
其它名稱 ADSPBF537BBCZ5B
規格 類型 定點
接口 CAN,SPI,SSP,TWI,UART
時鐘速率 500MHz
非易失性存儲器 外部
片載 RAM 132kB
電壓 - I/O 2.50V,3.30V
電壓 - 內核 1.26V
工作溫度 -40°C ~ 85°C(TA)
安裝類型 表面貼裝型
封裝/外殼 208-FBGA,CSPBGA
供應商器件封裝 208-CSPBGA(17x17)
文檔 設計資源 Development Tool Selector
圖像和媒體 產品相片 208-CSPBGA
特色產品 Analog Devices IoT and the Intelligence of Things
Sensor Signal Chain
相關零件 配用 ADZS-BF537-ASKIT-ND-ADSP-BF537 EVAL BRD
ADZS-BF537-EZLITE-ND-EZ-KIT LITE ADSP-BF537 EVAL BRD
ADZS-BF537-STAMP-ND-ADSP-BF537 EVAL BRD
而這其中,也存在著諸多挑戰,賽靈思高端ACAP與FPGA高級產品線經理Mike Thompson分析到:“隨著摩爾定律的消亡,晶體管不會自然而然變得更快、功耗更低或者成本更低,因此我們需要新的創新去突破芯片節點式的技術推進。絕大多數創新都是來自于集成,比如我們看一下我們集成的這些技術和之前FPGA進行比較的話,可以說有很多都是可以被我們的產品取代的現有技術,正是通過這樣的方式,我們才能夠超越摩爾定律。而且除此以外,我們ACAP尤其是Versal Premium它的集成非常豐富,也是非常廣泛的,比如我們有應用處理器、實時處理器、平臺控制器,還有存儲器界面和各種各樣的連接,所有這些都能夠為客戶提供非常高效的解決方案,所以客戶不需要拿一塊很大的板上面各自去裝,只需要一個器件Versal Premium就可以實現了。”
“自適應”AI加速的重要性
當然,為了能夠適應這一產品的主戰場即5G網絡基礎設施的應用需求,背后必然少不了強大的AI加速和處理能力。如今,各類應用場景對智能化需求的持續高漲,AI加速器也越來越多的被嵌入到相應的設備當中,成為提升智能特性以及加速數據處理的關鍵角色。這種加速,其實就類似于90年代末和2000年代初的DSP淘金熱。當時,隨著有線和無線通信的興起,市場紛紛推出高性能的DSP協處理器以應對基帶處理的挑戰,與DSP協處理器一樣,AI加速器的目標是找到執行海量運算所需最快、最節能的方式。
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